Special Topics


Program



Asia Committee

ASIA COMMITTEE CHAIR

Prof. Hyunjae Kim , Yonsei University, Korea

  • Hideki Asada, NLT Technologies, Ltd., Kawasaki, Kanagawa, Japan

  • Prof. Byung-Seong Bae, College of New IT Engineering, Hoseo University, Asan, Chungnam, Korea

  • Chien Hung Chen, AU Optronics Corporation, Hsinchu, Taiwan

  • Philip Chen, National Chiao Tung University, Hsinchu, Taiwan

  • Po-Lun Chen, AU Optronics Corp., Hsinchu, Taiwan

  • Dong Hoon Choi, Korea University, Seoul, Korea

  • Eun Ha Choi, Kwangwoon University, Seoul, Korea

  • Jong Sun Choi, Hongik University, Seoul, Korea

  • Kyung Cheol Choi, KAIST, Daejeon, Korea

  • Joo-Young Chung, Suwon University, Kyunggi Do, Korea

  • Lee-Mi Do, ETRI, Daejeon, Korea

  • Tsutomu Furuhashi, Hitachi Displays, Ltd., Mobara, Chiba, Japan

  • Jeong-In Han, Korea Electronics Technology Institute, Gyeonggi-do, Kyoungki-do, Korea

  • Reiji Hattori, Kyushu University, Fukuoka, Japan

  • Chishio Hosokawa, Idemitsu Kosan Co., Ltd., Sodegaura, Chiba, Japan

  • Hsing-Hung Hsieh, Polyera Taiwan Corp., Hsinchu, Taiwan

  • Yi Pai Huang, National Chiao Tung University, Hsinchu, Taiwan

  • Yukinobu Iguchi, Field Emission Technologies, Mizunami, Gifu, Japan

  • Yasufumi Iimura, Tokyo University of Agriculture & Technology, Koganei, Tokyo, Japan

  • Jin Jang, Kyung Hee University, Seoul, Korea

  • Ju Young Jeong, The University Of Suwon, Hwasung, Korea

  • Byeong-Kwon Ju, Korea University Natural and Science Campus, Seoul, Seongbuk-gu, Korea

  • Hideaki Kawakami, Advanced Interconnect Material LLC, Chiba-shi, Chiba, Japan

  • Junji Kido, Yamagata University, Yonezawa, Yamagata, Japan

  • Hyun Jae Kim, Yonsei University, Seoul, Korea

  • Jae Hoon Kim, Hanyang University, Seoul, Korea

  • Sung-Kyu Kim, Korea Institute of Science and Technology, Seoul, Korea

  • Woo Young Kim, Hoseo University, Chungnam, Korea

  • Yong Seog Kim, Chair, Hongik University, Seoul, Korea

  • Shunsuke Kobayashi, Tokyo University of Science, Sanyo-Onoda, Yamaguchi, Japan

  • Toshihiro Komaki, Panasonic Corporation, Ibaraki-shi, osaka, Japan

  • Katsumi Kondo, Sharp Corp, Kashiwa-shi, Chiba, Japan

  • Jang Hyuk Kwon, Kyung Hee University, Seoul, Korea

  • Oh-Kyong Kwon, Hanyang University, Seoul, Korea

  • Myong-Hoon Lee, Chonbuk National University, Chonju, Chonbuk, Korea

  • Sin-Doo Lee, Seoul National University, Seoul, Korea

  • Sungkyoo Lim, Dankook University, Cheonan, Chungnam, Korea

  • David Liu, DTC/ITRI, Chutung, Hsinchu, Taiwan

  • Po-Tsun Liu, National Chiao Tung University, Hsinchu, Taiwan

  • Shohei Naemura, Tottori University Electronic Display Research Center, Tottori, Japan

  • Masayuki Nakamoto, Shizuoka University, Hamamatsu, shizuoka, Japan

  • Myung Hwan Oh, Dankook University, Yongin-si, Gyonggi-do, Korea

  • Makoto Ohkura, Hitachi Displays, Ltd., Mobara, Chiba, Japan

  • Sakuichi Ohtsuka, Kagoshima University, Kagoshima, Japan

  • Soichiro Okuda, Sonac Incorporated, Nara, Japan

  • Fujio Okumura, NEC Corporation, Sagamihara, Kanagawa, Japan

  • Haruhiko Okumura, Toshiba Corporation, Kawasaki, Kanagawa, Japan

  • Lee Soon Park, Kyungpook National University, Daegu, Korea

  • Yukito Saitoh, FUJIFILM Corporation, Kanagawa, Japan

  • Tomokazu Shiga, The University Of Electro-Communications, Tokyo, Japan

  • Yoshifumi Shimodaira, Shizuoka University, Hamamatsu, Shizuoka, Japan

  • Shoji Shirai, Hitachi, Ltd, Mobara-shi, chiba-ken, Japan

  • Hoe-Sup Soh, Hoseo University, Asan-city, chungnam, Korea

  • Jun Someya, Mitsubishi Electric Corporation, Amagasaki, Hyogo, Japan

  • Tsunehiko Sugawara, Chiba, Japan

  • Linsu Tong, South East University, Electronic Research Institute, Nanjing, Jiangsu, China

  • Tu Sheng Tsai, Display Technology Center, Hsinchu, Taiwan

  • Takatoshi Tsujimura, Kodak Japan, Ltd., Yokohama, Kanagawa, Japan

  • Tatsuo Uchida, Seidai National College of Technology, Sendai, Miyagi, Japan

  • Sashiro Uemura, Noritake Itron Corp., Ise, Mie, Japan

  • Prof. Qiong-Hua Wang, School of Electronic and Information Engineering, Sichuan University, China

  • Ki-Woong Whang, Seoul National University, Seoul, Korea

  • Chung-Chih Wu, National Taiwan University, Taipei, Taiwan

  • Hee-Sun Yang, Hongik University, Seoul, Korea

  • Tae-Hoon Yoon, Pusan National University, Busan, Korea

  • Shuxiu Zhang, Daiden Co., Ltd., Miyaki-Gun, Saga, Japan

  • Changchang Zhu, TCL Corporate Research, Shenzhen, Guangdong, China

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    • 请点击下载中文版报名表;这是优惠期的报名表.
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